Glass Laser Cutting Machine / Picosecond Laser Cutting Machine
Picosecond laser glass cutting delivers high efficiency, clean processing, and supports mass production. It is suitable for a wide range of industries and can cut glass into any required shape with precision. The system handles glass thicknesses from 1 mm to 25 mm, offering excellent flexibility for diverse applications.
Laser Power: 60W | 80W | 90W
Model Number: HS-Pi60 | HS-Pi80 | HS-Pi90
High-Performance Picosecond Glass Laser Cutting System
Our picosecond laser cutting machines combine advanced picosecond and RF $CO_2$ laser sources to deliver a high-efficiency, automated solution for transparent materials. Specifically engineered for sapphire, white, and ultra-clear glass, this system ensures micro-level precision across diverse sectors—including consumer electronics, medical optics, and automotive glass—achieving flawless results with zero mechanical stress.
Micro-Level Precision
Utilizes ultra-short pulse technology to achieve superior edge quality. It minimizes the heat-affected zone, ensuring burr-free, intricate cuts for high-end optical lenses and smart wearable dials.
Industrial Mass Production
Designed for automated workflows and high-speed throughput. The stable laser interaction allows for repeatable, high-quality cutting, significantly lowering unit costs for large-scale manufacturing.
Versatile Glass Applications
Processes a wide range of materials from 1mm to 25mm thickness. Perfectly suited for automotive mirrors, medical instruments, camera lenses, and luxury watch glass production.
Clean & Eco-Friendly
A sustainable dry-cutting process that eliminates the need for water cooling or chemical additives. It maintains a dust-free environment and reduces the need for expensive post-processing.
Why need to use a different laser source for cutting glass?
Picosecond laser source for cutting different shape and pre-cut, cut more thickness picosecond laser can not cut out glass once a time, therefore must use RF co2 laser to cut out of the galss
well, The RF co2 laser source power have to 100W or 150W is better for cut out the glass.
Customizable Large‑Format Laser Cutting Workbench
The standard workbench format of our machine is 600*700mm, with double-station cutting workbench, we also can support customization
But this means more manufacturing costs and longer lead times,sometimes our customers required 1000x2500mm,1500x3000mm,and so on.
Glass laser cutting machine programming
Picosecond laser source for cutting machine only support English and Chinese, you can prhramming any cutting shape what do you want.
Glass laser cutting machine is not only a cutting machine but also a precision glass drilling,punching machine.
Industrial Precision: Picosecond Laser Glass Cutting System
Our HS-Pi picosecond laser series represents the pinnacle of glass processing technology, utilizing ultra-short pulses to achieve micrometer-level accuracy ($1 \mu m$). Designed for high-speed, non-thermal “cold ablation,” it effortlessly cuts ultra-thin, tempered, and sapphire glass (0.1mm – 25mm) at speeds up to 500mm/s. This automated, high-throughput system eliminates micro-cracks and post-processing, making it the premier choice for semiconductor, smartphone, and medical device manufacturing.
Micro-Level Precision
Utilizes ultra-short picosecond pulses for a nearly zero Heat-Affected Zone (HAZ). This "cold ablation" process achieves sub-micron roughness and eliminates micro-cracks, ensuring the structural integrity of delicate substrates like Gorilla Glass and wafers.
High-Speed Throughput
Engineered for industrial mass production, delivering cutting speeds of 100-500mm/s. High repetition rates and stable energy delivery maximize output while significantly reducing unit processing time compared to CO2 or nanosecond lasers.
Superior Edge Quality
Produces flawless, clean-cut edges that require zero post-processing, such as polishing or grinding. This precision reduces material waste and enhances the mechanical strength of components used in luxury watches and automotive displays.
Smart Industry 4.0 Ready
Fully compatible with CNC systems and robotic automation. This energy-efficient, low-maintenance solution integrates seamlessly into smart factories, offering consistent repeatability for complex geometries in high-tech manufacturing.
Picosecond Laser Glass Cutting Machine vs. Water Jet Cutting Machine
| Feature | Picosecond Laser Cutting | Water Jet Cutting |
|---|---|---|
| Cutting Mechanism | Uses ultra-short laser pulses (cold ablation) to vaporize glass at a microscopic level. | Uses high-pressure water mixed with abrasive particles to erode glass. |
| Precision | Extremely high (micron-level accuracy). Ideal for intricate and micro-scale cutting. | Moderate to high but less precise than laser cutting, especially for fine details. |
| Heat-Affected Zone (HAZ) | Minimal (cold processing prevents thermal damage). | None (purely mechanical erosion). |
| Edge Quality | Very smooth (no chipping or microcracks, no post-processing needed). | Rough edges with possible chipping, requiring polishing or grinding. |
| Material Thickness | Best for thin to medium-thickness glass (0.1mm – 5mm). | Can handle thicker glass (up to 200mm) but with lower precision. |
| Processing Speed | Faster for thin and delicate glass (100-500 mm/s). | Slower, especially for thicker glass, as multiple passes are needed. |
| Material Waste | Minimal (high efficiency, no tool wear). | More waste due to abrasive material use. |
| Environmental Impact | Cleaner process, no hazardous waste. | Produces slurry waste from abrasives, requiring disposal. |
| Cost Efficiency | High initial cost but low operating costs. | Lower initial cost but high ongoing cost (abrasives, water consumption, waste management). |
| Automation & Integration | Easily integrates with CNC and robotic systems. | Requires complex setup for automated systems. |
Verdict:
Picosecond laser cutting is best for high-precision, clean-edge cutting of thin glass, used in electronics, optics, and medical applications.
Water jet cutting is better for thicker glass and industrial applications, where precision is less critical but material thickness is high.
Comparison of Other Traditional Glass Cutting Methods
| Method | Advantages | Disadvantages |
|---|---|---|
| Picosecond Laser Cutting | – Ultra-precise, minimal thermal damage. – No post-processing required. – High-speed processing, automation-friendly. | – High initial cost. – Best for thin to medium glass only. |
| Water Jet Cutting | – No heat damage. – Can cut very thick glass. – Handles laminated glass well. | – Lower precision than laser. – Rough edges require post-processing. – High operating costs (abrasives, water waste). |
| Diamond Scribing & Breaking | – Simple and low-cost. – Suitable for straight-line cuts. | – Limited to flat glass. – Generates microcracks, reducing strength. – Poor precision for curved or intricate cuts. |
| CO₂ Laser Cutting | – Can cut thicker glass than picosecond lasers. – More affordable than ultrafast lasers. | – High heat-affected zone (HAZ), leading to thermal stress and cracks. – Requires additional cooling and post-processing. |
| CNC Mechanical Cutting (Rotary Blades) | – Good for large-scale cutting. – Handles thicker glass than picosecond lasers. | – Causes chipping and stress fractures. – Tool wear leads to high maintenance costs. |
| Technical Parameters | |
| Model number: HS-Pi60 / HS-Pi80 / HS-Pi90 | Power supply:Single-phase 220V±10%, 50/60Hz AC |
| Laser power: 60W 80W 90W | Whole machine power consumption: |
| Laser type: Picosecond laser and RF co2 laser | Working environment humidity:20-26°C |
| Laser wavelength: 1064±5nm | Control system:HS LASER (customized ) Support English operation system |
| Working area: Standard 600x700mm double working table | CNC machine bed:Plate sheet welding |
| Repetition Rate:Single Shot to 8 MHz | Working desk:Marble countertop |
| Spatial Mode: M^2 < 1.3 | Pulse Width Measured at 1064nm: 10 picoseconds |
| Pointing Stability Over Constant Temperature +/2 °C: < 50 μrad / °C | Machine weight:>5ton |
| Picosend cutting speed:500mm/s | Laser cutting head:Bessel |
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